SMD2018貼片自恢復(fù)保險絲

Performance Specification

Model	V _max (V dc)	I_max (A)	I _hold @25°C (A)	I _trip @25°C (A)	P_d Typ. (W)	Maximum Time To Trip		Resistance
Model	V _max (V dc)	I_max (A)	I _hold @25°C (A)	I _trip @25°C (A)	P_d Typ. (W)	Current (A)	Time (Sec)	R i _min (W)	R1max (W)
SMD2018-030SF	60	10	0.30	0.60	0.9	1.5	3.00	0.500	2.300
SMD2018-050SF	60	10	0.55	1.20	1.0	2.5	3.00	0.200	1.000
SMD2018-075SF	60	10	0.75	1.50	1.1	8.0	0.30	0.110	0.630
SMD2018-100SF	15	35	1.10	2.20	1.1	8.0	0.40	0.060	0.360
SMD2018-100SF33V	33	35	1.10	2.20	1.1	8.0	0.40	0.060	0.360
SMD2018-150SF	15	35	1.50	3.00	1.1	8.0	0.80	0.050	0.170
SMD2018-200SF	10	35	2.00	4.00	1.1	8.0	2.40	0.030	0.100

V max = Maximum operating voltage device can withstand without damage at rated current (Imax).

I max = Maximum fault current device can withstand without damage at rated voltage (V max).

I hold = Hold Current. Maximum current device will not trip in 25°C still air.

I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.

Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.

R1max = Maximum device resistance is measured one hour post reflow.

CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.

Environmental Specifications

Test	Conditions	Resistance change
Passive aging	+85°C, 1000 hrs.	±5% typical
Humidity aging	+85°C, 85% R.H. , 168 hours	±5% typical
Thermal shock	+85°C to -40°C, 20 times	±33% typical
Resistance to solvent	MIL-STD-202,Method 215	No change
Vibration	MIL-STD-202,Method 201	No change
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C

Thermal Derading Chart

Recommended Hold Current(A) at Ambient Temperature(°C)

Model	Ambient Operation Temperature
Model	-40°C	-20°C	0°C	25°C	40°C	50°C	60°C	70°C	85°C
SMD2018-030SF	0.48	0.42	0.35	0.30	0.24	0.21	0.17	0.15	0.10
SMD2018-050SF	0.87	0.77	0.67	0.55	0.46	0.41	0.36	0.31	0.23
SMD2018-075SF	1.19	1.05	0.91	0.75	0.61	0.54	0.47	0.41	0.32
SMD2018-100SF	1.71	1.52	1.32	1.10	0.94	0.84	0.74	0.64	0.50
SMD2018-150SF	2.38	2.10	1.82	1.50	1.27	1.13	0.99	0.85	0.64
SMD2018-200SF	2.95	2.65	2.35	2.00	1.74	1.59	1.44	1.29	1.06

Thermal Derating Curve

Average Time-Current Curve

Soldering Parameters

Profile Feature	Pb-Free Assembly
Average Ramp-Up Rate(Ts max to T p)	3℃/second mac.
Preheat -Temperature Min(Ts min) -Temperature Max(Ts max) -Time(Ts min to Ts max)	150℃ 200℃ 60~180 seconds
Time maintained above: -Temperature(TL) -Time(tL)	217℃ 60~150 seconds
Peak Temperature(Tp)	260℃
Ramp-Down Rate	6℃/second max.
Time 25℃ to Peak Temperature	8 minutes max
Storage Condition	0℃~30℃,30%~60%RH

Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free

Recommended maximum paste thickness is 0.25mm

Devices can be cleaned using standard industry methods and solvents.

Note 1:All temperature refer to topside of the package, measured on the package body surface.

Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

Physical Dimensions(mm.)

Model	A		B		C		D	E
Model	Min.	Max.	Min.	Max.	Min.	Max.	Min.	Min.
SMD2018-030SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-050SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-075SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-100SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-100SF33V	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-150SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-200SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25

Termination Pad Characteristics

Terminal pad materials：Tin-plated Nickel-Copper

Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

Recommended Pad Layout (mm.)

Tape And Reel Specifications (mm)

Governing Specifications		EIA 481-1
W		12.0 ± 0.2
P0		4.0 ± 0.10
P1		8.0 ± 0.10
P2		2.0 ± 0.05
A0		4.40 ± 0.10
B0		5.50 ± 0.10
B1max.		8.20
D0		1.50 + 0.1, -0
F		5.5 ± 0.05
E1		1.75 ± 0.10
E2min.		10.25
T		0.6
T1max.		0.1
K0		1.36 ± 0.1
Leader min.		390
Trailer min.		160
Reel Dimensions
A max.		178
N min.		50
W1		12.4 ± 0.5
W2		18.4 ± 0.5

Storage And Handling
? Storage conditions：0℃~30℃, 30%~60% R.H.
? Devices may not meet specified performance
if storage conditions are exceeded.

Part Number System

SMD 2018 - 口口口 S F 口口V
special voltage Rating(Optional)

Lead-Free

Tin-plated Nickel-Copper

Holding Current Rating

Device Dimensions: Length/width(Unit:1/100 inch) Size 5045 mm / 2018 inch

Surface Mount Device

東莞市富寬源電子有限公司（東莞市富源電子科技有限公司）成立于1998年，主要從事安規(guī)元器件生產(chǎn)和銷售，通過10年的改革和努力現(xiàn)在的富寬源已經(jīng)成為集生產(chǎn)和銷售為一體的安規(guī)元器件總匯；富寬源將繼續(xù)秉持品質(zhì)第一、服務(wù)客戶的原則不斷為廣大客戶提供質(zhì)優(yōu)價廉的產(chǎn)品。我公司目前主要提供如下產(chǎn)品: 電流保險絲-CurrentFuse 玻璃管電流保險絲陶瓷管電流保險絲貼片電流保險絲電阻式保險絲微型電流保險絲高壓電流保險絲直流電流保險絲交流電流保險絲 SMD-貼片式自恢復(fù)保險絲 AI-插件式自恢復(fù)保險絲保險絲座-Fuseholder ESTMF系列保險絲座 EDKFH系列保險絲座 SKPTF系列保險絲座 AUTO--汽車保險絲座 OPWOP系列保險絲座拉線盒式保險絲座保險絲夾&端子保險管座保險座大電流|高壓保險座溫度保險絲-Thermalcutoffs 方塊形溫度保險絲電阻式溫度保險絲大電流溫度保險絲陶瓷溫度保險絲鐵殼溫度保險絲 SW.C溫度保險絲 NEC溫度保險絲艾默生溫度保險絲內(nèi)橋溫度保險絲松下溫度保險絲 AUPO溫度保險絲溫度開關(guān)/溫控器-Thermalprotector 熱保護器/可恢復(fù)溫控器風(fēng)筒式溫控開關(guān)/溫控器馬達熱保護器/溫控器除霜除濕溫控器/溫控開關(guān) 超低溫溫控開關(guān)/溫控器微型溫控開關(guān)/溫控器溫度開關(guān)/溫控器-Thermalprotector 7AM/17AM溫控器 KSD301系列溫開關(guān) KSD-01F插腳溫開關(guān) 9700系列方塊形溫控開關(guān) BR系列溫控開關(guān) SEKIST-22溫控器壓敏電阻-Varistors 壓敏電阻氧化鋅壓敏阻器貼片壓敏電阻 SMD壓敏電阻插件型壓敏電阻高能壓敏電阻汽車保險絲Autofuse/carfuse 小號汽車插片保險絲FY-MIN 中號汽車插片保險絲FY-ATC 大號汽車插片保險絲FY-MAX 小號叉栓式汽車保險絲FY-UF 大號汽車叉栓式保險絲FY-MF 管狀|柱狀汽車保險絲其他型號汽車保險絲過載保護器-CIRCUITBREAKER AR1/AR2系列過載保護器 W系列過載保護器 88/88A系列過載保護器 90系列過載保護器 91/91L系列過載保護器 97/98/98H系列過載保護器帶開關(guān)系列過載保護器熱敏電阻-NTC/PTCThermistor 負溫度系數(shù)熱敏電阻陶瓷正溫度系數(shù)熱敏電阻高分子正溫度系數(shù)熱敏電阻溫度傳感器濕度傳感器本公司將繼續(xù)通過ISO9000質(zhì)量管理體系的有效實施，使涉及企業(yè)生產(chǎn)經(jīng)營的各個運作環(huán)節(jié)，均嚴謹有序，不斷制造出質(zhì)優(yōu)價廉、適銷對路的產(chǎn)品參與市場競爭，使企業(yè)長期保持較強的經(jīng)營獲利能力。同時我們將長期重視與行業(yè)知名企業(yè)合作，爭取最大限度的代理權(quán)，以最優(yōu)惠的價錢把產(chǎn)品銷售給客戶。

<< 上一頁：SMD0603貼片自恢復(fù)保險絲 || 下一頁：沒有了 >>