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1032(3X10)方頭貼片保險(xiǎn)絲

 

Description

The SMD1032 High Current Fuse is a small square surface mount fuse that is designed to support higher current requirements of various applications.

Features

? Surface mount high current fuse ? Fully compatible with lead-free solder alloys and higher temperature profiles associated with lead-free assembly ? RoHS compliant and Halogen Free ? Available in ratings of 1 to 40 Amperes

Applications

? High end servers / Blade computing? Base station power supply? Voltage regulator module? Cooling fan system for PC Server? Advance Telecommunication Computing Architecture (ATCA) applications for cloud computing? Battery Management System (Industrial Tools)

Material Details

NO.

Part Name

Material

1

 End caps

Copper Plating/Silver

2

 Body

 Ceramic Tube

3

 Fuse

Alloy wire

4

Explosion proof sand

quartz sand


Electrical Characteristics for Series

% of Ampere  rating

OpeningTime

100%

4 hours, Minimum

200%

  60 sec., Max.

Electrical Specifications by Item

Ampere

Rating

(A)

Amp Code

MaxVoltage

Rating(V)

Interrupting

Rating

Nominal Cold

Resistance

(Ohms)

Nominal

Melting

I2t (A2sec)

Agency Approvals

UL

TUV

1.00

001.

125V/250V/300VAC

72V/125VDC

100A @125VAC

300A @ 65VAC

300A @ 100VDC

1000A @ 32VDC

500A @ 72VDC

0.2516

1.76

1.50

01.5

0.1186

4.70

2.00

002.

0.0708

6.76

2.50

02.5

0.0400

13.18

3.00

003.

0.0352

19.55

3.50

03.5

0.0261

32.70

4.00

004.

0.0227

40.80

5.00

005.

0.0171

59.59

6.00

006

0.0168

65.43

7.00

007

0.0153

68.57

8.00

008

0.0136

72.57

10.00

0001

0.0117

86.32

12.00

012

0.00254

116.45

15.00

015

0.00230

142

20.00

020

0.00191

435

30.00

030

0.00130

679

40.00

0.40

0.00089

900

 

Notes: - l2t calculated at 8ms. Resistance is measured at 10% of rated current, 23oC


 

Temperature Derating Curve

 

 

Notes:

1.  Derating depicted in this curve is in addition to the standard derating of 20% for continuous operation.

Example:For continuous operation at 75 degrees celsius, the fuse should be derated as follows:I = (0.80)(0.85)IRAT= (0.68)IRAT

Soldering Parameters


Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (Ts(min)) 150°C

- Temperature Max (Ts(max)) 200°C

- Time (Min to Max) (ts) 60 – 120 secs

Average ramp up rate (Liquidus Temp (TL) to peak

3°C/second max

TS(max) to TL - Ramp-up Rate

3°C/second max

Reflow

- Temperature (TL) (Liquidus) 217°C

- Temperature (tL) 60 – 90 seconds

Peak Temperature (TP)

 260+0/–5 °C

Time within 5°C of actual peak Temperature (tp)

20 – 40 seconds

Ramp-down Rate

5°C/second max.

Time 25°C to peak Temperature (TP)

8 minutes max.

Do not exceed

 260°C

Wave Soldering Parameters

260°C Peak Temperature,3 seconds max.


 

 

  

Product Characteristics

Materials

Body: Ceramic Terminations: Gold-plated Caps

Product Marking

Brand, Amperage Rating

Operating Temperature

-55°C to 300V°C

Moisture Sensitivity Level

Level 1, J-STD-020C

Solderability

MIL-STD-202, Method 208

Insulation Resistance (after Opening)

MIL-STD-202, Method 302,

Test ConditionA (10,000 ohms minimum)

Thermal Shock

MIL-STD-202, Method 107, Test Condition B, 5 cycles, -65°C to 300V°C, 15 minutes @ each extreme

Mechanical Shock

MIL-STD-202, Method 213, Test I:Deenergized. 100G’s pk amplitude, sawtooth wave 6ms duration, 3 cycles xYZ+xyz = 18 shocks

Vibration

MIL-STD-202, Method 201: 0.03" amplitude, 10-55 Hz in 1 min. 2hrs each xYZ=6hrs

Moisture Resistance

MIL-STD-202, Method 106, 10 cycles

Salt Spray

MIL-STD-202, Method 101, Test Condition B (48hrs)

Resistance to Soldering Heat

MIL-STD-202, Method 210, Test condition B (10 sec at 260°C)

  

Dimensions

 

Packaging

 

packaging Option

packaging Specification

Quantity

Quantity &packaging code

24 mm Tape and Reel

EIA RS-481-2

2000

ER

 

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